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| W77IE58P资料 | |
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W77IE58P PDF Download |
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File Size : 105 KB
Manufacturer:WINBOND Description:Conventional antenna switch modules used in GSM terminals and other prod- ucts adopt a structure in which passive and active elements, such as PIN diodes, are mounted on an LTCC, FR-4 or similar substrate. However, considering the demands for multimode and multiband op- eration, miniature low-height form factors, and lower costs in recent cellular phone products, it can easily be seen that it will be difficult to achieve these using these conventional structures. Sonys response to these issues was implemented using the mold array package, which uses lead frames, an existing package technology. By adopting an existing package that uses lead frames, Sony was able to assure the pin count required for the increase in the number of switches due to the use of multimode and multiband operation. Fur- thermore, this made further miniaturiza- tion easy. Another advantage was that it was pos- sible to keep to an absolute minimum the |
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| 1PCS | 100PCS | 1K | 10K | ||
| 价 格 | |||||
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型 号：W77IE58P 厂 家：WINBOND 封 装：00+ 批 号：123 数 量： 说 明： |
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运 费： 所在地： 新旧程度： |
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| 联系人：张小姐、 颜先生13661569158 |
| 电 话：400-878-9158,021-54286636 |
| 手 机：13661569158 |
| QQ：12230627,596815151,531081618 |
| MSN： |
| 传 真：021-54286636 |
| EMail：susumu@susumu.com.cn |
| 公司地址： 上海市古楼公路348弄25号 |
