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| UPB26LS31D资料 | |
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UPB26LS31D PDF Download |
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File Size : 105 KB
Manufacturer:NEC Description:The UPB26LS31D meets the increasing demands for higher output power in 3GPP 1XRTT handsets. The PA module is optimized for VREF = +2.85 V, a requirement for compatibility with the Qualcomm® 6250 chipset. The device is manufactured on an advanced InGaP HBT MMIC technology offering state-of-the-art reliability, temperature stability, and ruggedness. |
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| 1PCS | 100PCS | 1K | 10K | ||
| 价 格 | |||||
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型 号：UPB26LS31D 厂 家：NEC 封 装：88+ 批 号：18 数 量： 说 明： |
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运 费： 所在地： 新旧程度： |
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| 联系人：张小姐、 颜先生13661569158 |
| 电 话：400-878-9158,021-54286636 |
| 手 机：13661569158 |
| QQ：12230627,596815151,531081618 |
| MSN： |
| 传 真：021-54286636 |
| EMail：susumu@susumu.com.cn |
| 公司地址： 上海市古楼公路348弄25号 |
