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| TSB81BA3PFP资料 | |
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TSB81BA3PFP PDF Download |
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File Size : 105 KB
Manufacturer:TI Description:Notes a. Surface Mounted on 1 x 1 FR4 Board. b. Junction-to-foot thermal impedance represents the effective thermal impedance of all heat carrying leads in parallel and is intended for use in conjunction with the thermal impedance of the PC board pads to ambient (RthJA = RthJF + RthPCB-A). It can also be used to estimate chip temperature if power dissipation and the lead temperature of a heat carrying (drain) lead is known. |
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| 1PCS | 100PCS | 1K | 10K | ||
| 价 格 | |||||
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型 号：TSB81BA3PFP 厂 家：TI 封 装：04+ 批 号：184 数 量： 说 明： |
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运 费： 所在地： 新旧程度： |
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| 联系人：张小姐、 颜先生13661569158 |
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