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| SN74LS221N资料 | |
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SN74LS221N PDF Download |
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File Size : 105 KB
Manufacturer:MOT Description:CAUTION: THIS IS AN ESD SENSITIVE DEVICE. Chip carrier material should be selected to have GaAs compatible thermal coefficient of expansion and high thermal conductivity such as copper molybdenum or copper tungsten. The chip carrier should be machined, finished flat, plated with gold over nickel and should be capable of withstanding 325C for 15 minutes. Die attachment should utilize Gold/Tin (80/20) eutectic alloy solder and should avoid hydrogen environment for PHEMT devices. Note that the backside of the chip is gold plated and is used as RF ground. These GaAs devices should be handled with care and stored in dry nitrogen environment to prevent contamination of bonding surfaces. These are ESD sensitive devices and should be handled with appropriate precaution including the use of wrist grounding straps. All die attach and wire/ribbon bond equipment must be well grounded to prevent static discharges through the device. Recommended wire bonding uses 3 mils wide and 0.5 mil thick gold ribbon with lengths as short as practical allowing for appropriate stress relief. The RF input and output bonds should be typically 0.012 long corresponding to a typically 2 mil between the chip and the substrate material. |
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| 1PCS | 100PCS | 1K | 10K | ||
| 价 格 | |||||
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型 号：SN74LS221N 厂 家：MOT 封 装：97+ 批 号：5880 数 量： 说 明： |
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运 费： 所在地： 新旧程度： |
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| 联系人：张小姐、 颜先生13661569158 |
| 电 话：400-878-9158,021-54286636 |
| 手 机：13661569158 |
| QQ：12230627,596815151,531081618 |
| MSN： |
| 传 真：021-54286636 |
| EMail：susumu@susumu.com.cn |
| 公司地址： 上海市古楼公路348弄25号 |
