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| MC34072AP资料 | |
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MC34072AP PDF Download |
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File Size : 105 KB
Manufacturer:MOT Description: The power dissipation of the SOT-563 is a function of the pad size. This can vary from the minimum pad size for soldering to a pad size given for maximum power dissipa- tion. Power dissipation for a surface mount device is deter- mined by TJ(max), the maximum rated junction temperature of the die, RJA, the thermal resistance from the device junction to ambient, and the operating temperature, TA. Using the values provided on the data sheet for the SOT-563 package, PD can be calculated as follows: |
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| 1PCS | 100PCS | 1K | 10K | ||
| 价 格 | |||||
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型 号：MC34072AP 厂 家：MOT 封 装：99+ 批 号：59 数 量： 说 明： |
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运 费： 所在地： 新旧程度： |
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