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| MC14008BCP资料 | |
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MC14008BCP PDF Download |
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File Size : 105 KB
Manufacturer:MOT Description:Ground reference to LVDS and CMOS circuitry. For the LLP package, the DAP is used as the primary GND connection to the device. The DAP is the exposed metal contact at the bottom of the LLP-28 package. It should be connected to the ground plane with at least 4 vias for optimal AC and thermal performance. |
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| 1PCS | 100PCS | 1K | 10K | ||
| 价 格 | |||||
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型 号：MC14008BCP 厂 家：MOT 封 装：9038+ 批 号：75 数 量： 说 明： |
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运 费： 所在地： 新旧程度： |
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