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| LF398M/NOPB资料 | |
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LF398M/NOPB PDF Download |
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File Size : 105 KB
Manufacturer:NS Description:Note 6: If the TO-263 or TO-252 packages are used, the thermal resistance can be reduced by increasing the PC board copper area thermally connected to the package. Using 0.5 square inches of copper area. JA is 50˚C/W; with 1 square inch of copper area, JA is 37˚C/W; and with 1.6 or more square inches of copper area, JA is 32˚C/W. If the SOT-223 package is used, the thermal resistance can be reduced by increasing the PC board copper area (see applications hints for heatsinking). |
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| 1PCS | 100PCS | 1K | 10K | ||
| 价 格 | |||||
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型 号：LF398M/NOPB 厂 家：NS 封 装：07+ 批 号：15000 数 量： 说 明： |
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运 费： 所在地： 新旧程度： |
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