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| IS82C54资料 | |
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IS82C54 PDF Download |
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File Size : 105 KB
Manufacturer:HARIS Description:where TJ(max) is the maximum allowable junction tempera- ture of the die, which is 125C, and TA is the ambient operat- ing temperature. JA is dependent on the surrounding PC board layout and can be empirically obtained. While the JC (junction-to-case) of the SOT23-5 package is specified at 130C /W, the JA of the minimum PWB footprint will be at least 235C /W. This can be improved upon by providing a heat sink of surrounding copper ground on the PWB. Depending on the size of the copper area, the resulting JA can range from approximately 180C /W for one square inch to nearly 130C /W for 4 square inches. The addition of backside copper with through-holes, stiffeners, and other enhancements can also aid in reducing this value. The heat contributed by the dissipation of other devices located nearby must be included in design considerations. |
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| 1PCS | 100PCS | 1K | 10K | ||
| 价 格 | |||||
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型 号：IS82C54 厂 家：HARIS 封 装：99+ 批 号：60 数 量： 说 明： |
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