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| IDT7201LA15TP资料 | |
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IDT7201LA15TP PDF Download |
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File Size : 105 KB
Manufacturer:IDT Description:Notes a. Surface Mounted on 1 x 1 FR4 Board. b. When using HBM. The MM rating is 300 V c. See Reliability Manual for profile. The ChipFET is a leadless package. The end of the lead terminal is exposed copper (not plated) as a result of the singula- tion process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure adequate bottom side solder inter- connection. d. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components. |
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| 1PCS | 100PCS | 1K | 10K | ||
| 价 格 | |||||
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型 号:IDT7201LA15TP 厂 家:IDT 封 装:95+ 批 号:42 数 量: 说 明: |
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