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| DS12887A资料 | |
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DS12887A PDF Download |
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File Size : 105 KB
Manufacturer:DS Description:The ThinPakTM Package is a perforated, metalized ceramic substrate attached to the silicon using 302oC solder. An epoxy underfill is applied to protect the high voltage termination from debris. All exterior metal surfaces are tinned with 63pb/37sn solder providing the user with a circuit ready part. It's small size and low profile make it extremely attractive to high dI/dt applications where stray series inductance must be kept to a minimum. |
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| 1PCS | 100PCS | 1K | 10K | ||
| 价 格 | |||||
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型 号：DS12887A 厂 家：DS 封 装：06+ 批 号：11 数 量： 说 明： |
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运 费： 所在地： 新旧程度： |
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| 联系人：张小姐、 颜先生13661569158 |
| 电 话：400-878-9158,021-54286636 |
| 手 机：13661569158 |
| QQ：12230627,596815151,531081618 |
| MSN： |
| 传 真：021-54286636 |
| EMail：susumu@susumu.com.cn |
| 公司地址： 上海市古楼公路348弄25号 |
建议使用分辨率:1024*768