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| DM74S571J资料 | |
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DM74S571J PDF Download |
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File Size : 105 KB
Manufacturer:NS Description:The THS4513 incorporates a (QFN) exposed thermal pad on the underside of the chip. This acts as a heatsink and must be connected to a thermally dissipative plane for proper power dissipation. Failure to do so may result in exceeding the maximum junction temperature which could permanently damage the device. See TI technical brief SLMA002 and SLMA004 for more information about utilizing the QFN thermally enhanced package. |
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| 1PCS | 100PCS | 1K | 10K | ||
| 价 格 | |||||
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型 号：DM74S571J 厂 家：NS 封 装：91+ 批 号：25 数 量： 说 明： |
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运 费： 所在地： 新旧程度： |
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| 联系人：张小姐、 颜先生13661569158 |
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