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| CGS74C2525MX资料 | |
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CGS74C2525MX PDF Download |
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File Size : 105 KB
Manufacturer:NS Description:1. Added DDR333 function 2. Updated DDR333 test specification 3. Deleted typical current in IDD spec. table 4. Included address and control input setup/hold time(tIS/tIH) at slow slew rate in DDR200/266 AC specification 5. Deleted Exit self refresh to write command(tXSW) in DDR200/266 AC specification 6. Changed unit of tMRD from tCK to ns at DDR333 7. Rename tXSA(exit self refresh to bank active command) to tXSNR(exit self refresh to non read command) at DDR200/266 8. Rename tXSR(exit self refresh to read command) to tXSRD at DDR200/266 9. Rename tWPREH(DQS in hold time) to tWPRE at DDR200/266 10. Rename tREF(Refresh interval time) to tREFI at DDR200/266 |
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| 1PCS | 100PCS | 1K | 10K | ||
| 价 格 | |||||
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型 号:CGS74C2525MX 厂 家:NS 封 装:04+ 批 号:2500 数 量: 说 明: |
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