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| CD54HC73F资料 | |
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CD54HC73F PDF Download |
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File Size : 105 KB
Manufacturer:TI Description:The new Smart 3 Advanced Boot Block, manufactured on Intels latest 0.4µ technology, represents a feature- rich solution at overall lower system cost. Smart 3 flash memory devices incorporate low voltage capability (2.7V read, program and erase) with high-speed, low-power operation. Several new features have been added, including the ability to drive the I/O at 1.8V, which significantly reduces system active power and interfaces to 1.8V controllers. A new blocking scheme enables code and data storage within a single device. Add to this the Intel-developed Flash Data Integrator (FDI) software and you have the most cost-effective, monolithic code plus data storage solution on the market today. Smart 3 Advanced Boot Block Byte-Wide products will be available in 40-lead TSOP and 48-ball µBGA* packages. Additional information on this product family can be obtained by accessing Intels WWW page: http://www.intel.com/design/flcomp |
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| 1PCS | 100PCS | 1K | 10K | ||
| 价 格 | |||||
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型 号:CD54HC73F 厂 家:TI 封 装:0905+ 批 号:87 数 量: 说 明: |
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运 费: 所在地: 新旧程度: |
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| 联系人:张小姐、 颜先生13661569158 |
| 电 话:400-878-9158,021-54286636 |
| 手 机:13661569158 |
| QQ:12230627,596815151,531081618 |
| MSN: |
| 传 真:021-54286636 |
| EMail:susumu@susumu.com.cn |
| 公司地址: 上海市古楼公路348弄25号 |