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| CD4069UBF资料 | |
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CD4069UBF PDF Download |
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File Size : 105 KB
Manufacturer:TI Description:Note 11: The multiplicity of parallel ground paths reduces the effective inductance of bonding wires and leads, which then reduces the noise caused by transients on the ground path. The various ground pins can be tied together provided that the external ground has low inductance. (i.e., ground plane with power pins and many signal pins connected to the backplane ground.) If the external ground floats considerably during transients, precautionary steps should be taken to prevent QGND from moving with reference to the backplane ground. The receiver threshold should have the same ground reference as the signal coming from the backplane. A volt- age offset between their grounds will degrade the noise margin. |
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| 1PCS | 100PCS | 1K | 10K | ||
| 价 格 | |||||
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型 号：CD4069UBF 厂 家：TI 封 装：0941+ 批 号：1607 数 量： 说 明： |
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