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| AM7201-50PC资料 | |
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AM7201-50PC PDF Download |
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File Size : 105 KB
Manufacturer:AMD Description:away from the substrate during the bonding process due to the deformation of the beam by the bonding tool. This effect is beneficial as it provides stress relief for the diode during thermal cycling of the substrate. The coefficient of expansion of some substrate materials, specifically soft substrates, is such that some bugging is essential if the circuit is to be operated over wide tempera- ture extremes. |
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| 1PCS | 100PCS | 1K | 10K | ||
| 价 格 | |||||
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型 号：AM7201-50PC 厂 家：AMD 封 装：9249+ 批 号：70 数 量： 说 明： |
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运 费： 所在地： 新旧程度： |
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