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| 1AB15291资料 | |
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1AB15291 PDF Download |
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File Size : 105 KB
Manufacturer:ALCATEL Description: The power dissipation of the SOTC23 is a function of the drain pad size. This can vary from the minimum pad size for soldering to a pad size given for maximum power dissipation. Power dissipation for a surface mount device is determined by TJ(max), the maximum rated junction temperature of the die, RJA, the thermal resistance from the device junction to ambient, and the operating temperature, TA. Using the values provided on the data sheet for the SOTC23 package, PD can be calculated as follows: |
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| 1PCS | 100PCS | 1K | 10K | ||
| 价 格 | |||||
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型 号：1AB15291 厂 家：ALCATEL 封 装：07+ 批 号：52 数 量： 说 明： |
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